JIS C 60068-2-14: Thermal Shock Testing for Automotive Components
JIS C 60068-2-14 is a standardized testing method designed to evaluate the ability of electrical and electronic products (components and equipment) to withstand rapid changes in ambient temperature.
The primary objective is to verify how physical stresses caused by temperature fluctuations—such as expansion and contraction—impact the product’s functionality and structural integrity.
Testing Case Study
This case study evaluates the durability and reliability of automotive components under environments subject to repeated, rapid temperature changes. Following JIS standards, the product was cycled between extreme low and high temperatures in short intervals to validate potential issues, including cracks or damage from thermal expansion/contraction and failures in electrical characteristics.
Objective of the Test
Automotive components are exposed to harsh temperature swings, ranging from freezing winter conditions to intense engine heat and direct summer sunlight. By applying rapid temperature changes (thermal stress), we identify structural failures, degradation of sealing performance, and defects caused by differing expansion rates in dissimilar materials at an early stage.
Test Details
| Item | Description |
| Industry | Passenger Vehicles |
| Test Specimen | Automotive Electrical & Mechanical Components |
| Applicable Standard | JIS C 60068-2-14 (Environmental testing – Test N: Change of temperature) |
| Test Equipment | Thermal Shock Chamber TSA-203-ES |
Test Conditions
- Low Temperature Setting: -20°C
- High Temperature Setting: 100°C
- Exposure Time: 1 hour per setting
- Number of Cycles: 300 cycles (continuous)
Key Evaluation Points & Results
- Strict Compliance with JIS Standards
Based on JIS C 60068-2-14, we maintained stable temperature transition rates and precise exposure times to ensure the acquisition of highly reliable data. - Verification of Thermal Stress Impact
By repeating a wide temperature differential (-20°C to 100°C) over 300 cycles, we conducted a thorough investigation into material fatigue, joint delamination, and the presence of solder cracks.
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